Assuming the pressure on the package is uniform and evenly distributed over the entire topside surface, the loading will be on the BGA ball. Each lead free ball can withstand ~3N of force (roughly .3 kg) before permanent deformation. Assuming a 484 ...
Lattice provides device specifications that help PCB designers in creating custom board designs. These device specifications are cataloged in the Package Diagrams pdf file. The Package Diagrams document provides information on physical dimensions and ...
For the mechanical drawing of the LIF-MD600 MasterLink Board, please proceed on the link below. http://www.latticesemi.com/en/Products/DevelopmentBoardsAndKits/CrossLinkLIFMD6000MasterLinkBoard Under Documentation table, select 'Design File' under ...