Assuming the pressure on the package is uniform and evenly distributed over the entire topside surface, the loading will be on the BGA ball. Each lead free ball can withstand ~3N of force (roughly .3 kg) before permanent deformation. Assuming a 484 ...
Use the Mentor Graphics Pads tool for viewing the BGA breakout and routing examples provided by Lattice. Download the free Mentor Graphics Pads tool from here. OR Use the Cadence Allegro Viewer after converting the .asc file to .brd file. Follow ...
Solution: For the JTAG input pins, use the LVCMOS input models, input threshold voltage is referenced using the VCCAUX value, and select the model that has: TCK: bus keeper = NONE TDI: bus keeper = pull up TMS: bus keeper = pull up For the JTAG ...