5302 - What is the difference between QFN32 described in the package diagrams document (FPGA‐DS‐02053) found on pages 18 and 19?

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• 7335 - Is there an available 3d model for any Lattice FPGA Devices?

  Lattice is not providing the 3D solid model but user can find the package diagram via FPGA-DS-02053.

• 632 - Where can I find a package view of my device?

  You can find the mechanical package drawing in our Packaging Diagrams datasheet: https://www.latticesemi.com/view_document?document_id=213 The package view with the pins in your design from the Lattice Diamond Project Navigator's main menu choose: ...

• 5615 - Crosslink: Is the pin-out for the LIA-MD6000-81 identical to the pinout for the LIF-MD6000-csfBGA81? I can download the Excel pinouts for the 'LIF' Crosslink family, but I cannot find separate documentation for the Crosslink Automotive device.

  For the pinout information of automotive parts, you may check FPGA-DS-02013, link: http://www.latticesemi.com/view_document?document_id=51753 They are of the same pinout information for LIF variants which is described in FPGA-DS-02007, link: ...

• 2072 - What is the optimum PCB solder mask opening and pad diameter for a Lattice package?

  Solution: This question is best answered by reviewing table 3.2 in FPGA-TN-02024. In the table, the Solder Mask Defined (SMD) and Non Solder Mask Defined (NSMD) PCB processing values are given. For the question of which type to use (SMD vs. NSMD), ...

• 5406 - Can Crosslink device layout be implemented without blind vias? Can I get an example for such layout?

  You can find an example page 7 of the PCB Layout Recommendation for BGA Packages (FPGA-TN-02024) document. The example given has blind vias while the other 3 examples (which is found on pages 16, 17 and 47) are stacked vias. However, it also depends ...