Lattice Diamond: How to view die pad to package pins delay numbers using Diamond?

Lattice Diamond: How to view die pad to package pins delay numbers using Diamond?

  1. Create or open a Diamond project that has the desired device targeted. Any design works.
  2. Open SSV (Spreadsheet View)
  3. From the GUI Menu, select File > Export > Pin Layout File..
  4. The Column Setting option box opens. Select "Trace Length" which if off by default.
  5. Provide a file name and .csv extension. (e.g., test.csv) then click OK. It will generate the pin layout file.
  6. Go to the folder location (By default, project folder) and open the generated csv.
  7. The Trace Length (die to package delay) data can be found here. The unit is micro meter (um).