If not specified on the "Device/Package Thermal Resistance" section you can refer to the generic table, Table 3.1. Package Thermal Resistance. This section specifies the generic thermal resistance for legacy Generic Array Logic (GAL), CPLD, FPGA and ...
Solution:The Lattice Thermal Management document provides these details and can be found here: Thermal Management Pg. 3 gives the package data for the TQFP 48, 1.4mm thick (applicable package for the POWR1014/A) for Package Thermal Resistance ...
You can find list of the available programming socket adapters by going to Lattice's socket adapter web page. Please check with your authorized Lattice Distributor for availability of the socket adapter you are looking for.
Lattice has provided our customers with 2 documents that describe what materials are used in our devices. The first is the "Package Device Material Breakdowns" document which shows the breakdown by weight of the various different substances contained ...
Please refer to the FPGA-TN-02041 (Solder Reflow Guide for Surface Mount Devices) for the Solder reflow and rework process for Lattice surface mount products. The downloadable link of the document can be found here: ...