5772 - Where can I find the Package Thermal Resistance value of a legacy device or a device that is not specified on the Thermal Management Technical Note (FPGA-TN-02044)?

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• 2547 - ispPAC-POWR1014/A: Where can I find information about the package thermal resistance of the ispPAC-POWR1014/A device?

  Solution:The Lattice Thermal Management document provides these details and can be found here: Thermal Management Pg. 3 gives the package data for the TQFP 48, 1.4mm thick (applicable package for the POWR1014/A) for Package Thermal Resistance ...

• 689 - Where can I find the Thermal Resistance values for the Lattice devices?

  The information for package and thermal characteristics details can be found at the following link - Thermal Management

• 1545 - Where can I find Quality and Reliability report for a Lattice device?

  All reports regarding Quality and Reliability can be found on Lattice Smiconductors website, please follow the link Quality and Reliability Reports. One can find Product Family Qualification Summaries for various devices,which describes quality and ...

• 7304 - iCE40: Where can I find NVCM/Data Retention information for ICE40 UltraPlus device family?

  Description: The ICE Ultra Plus device is a member of the ICE family which uses a common NVCM technology which is reported in the referenced qualification report. The qualification and reliability stress data applies to all devices in the ICE family. ...

• 1072 - What is the solder reflow condition for Lattice DIP device package?

  Lattice provides soldering guide for surface mount device in FPGA-TN-02041. PDIP packages are not surface mounted device thus it is not subjected to JEDEC reflow conditions. User should refer to standard wave soldering process for PDIP devices. The ...