1072 - What is the solder reflow condition for Lattice DIP device package?

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• 801 - Power Manager II: What is the Peak Reflow Temperature for the ProcessorPM or POWR605?

  Please refer to FPGA-TN-02041 - Solder Reflow Guide for Surface Mount Devices for more details. The ProcessorPM and POWR605 are the same device with QFNS 24 package type. User may refer to Table 8.2. Peak Reflow Temperature (TP) by Package Type and ...

• 1105 - What is the moisture sensitivity level (MSL) of Lattice devices?

  All Lattice through-hole mount devices are 28-pins or fewer and have an MSL of 1. For surface mount devices, please refer to respective package MSL in FPGA-TN-02041 - Solder Reflow Guide for Surface Mount Devices.

• 2143 - Where can I find MSL (Moisture Sensitivity Level) for various packages of Lattice devices?

  Please refer to the FPGA-TN-02041 (Solder Reflow Guide for Surface Mount Devices) for the Solder reflow and rework process for Lattice surface mount products. The downloadable link of the document can be found here: ...

• 2547 - ispPAC-POWR1014/A: Where can I find information about the package thermal resistance of the ispPAC-POWR1014/A device?

  Solution:The Lattice Thermal Management document provides these details and can be found here: Thermal Management Pg. 3 gives the package data for the TQFP 48, 1.4mm thick (applicable package for the POWR1014/A) for Package Thermal Resistance ...

• 1545 - Where can I find Quality and Reliability report for a Lattice device?

  All reports regarding Quality and Reliability can be found on Lattice Smiconductors website, please follow the link Quality and Reliability Reports. One can find Product Family Qualification Summaries for various devices,which describes quality and ...